XC7Z035-3FBG676E

Product Overview

Category

XC7Z035-3FBG676E belongs to the category of programmable System-on-Chip (SoC) devices.

Use

This product is commonly used in various electronic applications that require high-performance processing capabilities and flexibility.

Characteristics

• Programmable SoC with integrated processing system and programmable logic
• High-performance ARM Cortex-A9 processor cores
• FPGA fabric for customizable hardware acceleration
• On-chip memory and peripherals for system integration
• Advanced connectivity options for seamless communication

Package

XC7Z035-3FBG676E is available in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of XC7Z035-3FBG676E lies in its ability to combine the power of a processor and the flexibility of an FPGA, enabling developers to create highly optimized and customized solutions.

Packaging/Quantity

XC7Z035-3FBG676E is typically sold individually or in small quantities, depending on the supplier.

Specifications

• FPGA Logic Cells: 247,000
• Block RAM: 1,620 KB
• DSP Slices: 900
• Maximum Operating Frequency: 1 GHz
• Operating Voltage: 0.95V - 1.05V
• Operating Temperature Range: -40°C to +100°C

Detailed Pin Configuration

For a detailed pin configuration diagram of XC7Z035-3FBG676E, please refer to the official documentation provided by the manufacturer.

Functional Features

XC7Z035-3FBG676E offers several functional features that make it a versatile choice for various applications:

• Dual-core ARM Cortex-A9 processors provide high-performance processing capabilities.
• FPGA fabric allows for hardware customization and acceleration, enhancing overall system performance.
• On-chip memory and peripherals enable seamless integration of system components.
• Advanced connectivity options, such as Ethernet, USB, and PCIe, facilitate efficient data transfer.

Advantages and Disadvantages

Advantages

• High-performance processing capabilities
• Flexibility and customization options with FPGA fabric
• Integration of multiple system components on a single chip
• Advanced connectivity options for efficient communication

Disadvantages

• Complex design and programming requirements
• Higher cost compared to traditional microcontrollers or processors
• Steeper learning curve for developers unfamiliar with FPGA technology

Working Principles

XC7Z035-3FBG676E operates based on the principles of combining a processor and an FPGA. The ARM Cortex-A9 processors handle general-purpose computing tasks, while the FPGA fabric allows for hardware customization and acceleration. The processors and FPGA communicate through a high-speed interconnect, enabling seamless collaboration between software and hardware components.

Detailed Application Field Plans

XC7Z035-3FBG676E finds applications in various fields, including but not limited to:

1. Embedded Systems: Used in industrial automation, robotics, and IoT devices for high-performance computing and real-time control.
2. Communications: Employed in networking equipment, routers, and switches for packet processing and protocol offloading.
3. Aerospace and Defense: Utilized in radar systems, avionics, and military-grade communication systems for signal processing and encryption.
4. Medical Devices: Integrated into medical imaging equipment, patient monitoring systems, and diagnostic instruments for data processing and analysis.

Detailed and Complete Alternative Models

Some alternative models to XC7Z035-3FBG676E that offer similar functionality include:

1. XC7Z045-2FFG900C
2. XC7Z100-2FFG900I
3. XC7Z020-1CLG484C

These models vary in terms of FPGA capacity, processor performance, and package options. It is recommended to consult the manufacturer's documentation for detailed specifications and suitability for specific applications.

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