IS46DR16320C-3DBLA1

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics: High-speed, low-power, high-density
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Tray packaging, quantity varies

Specifications

• Memory Type: Synchronous DRAM (SDRAM)
• Capacity: 16 Gigabits (2 Gigabytes)
• Organization: 2G x 8 bits
• Speed: DDR4-3200 (3200 Megatransfers per second)
• Voltage: 1.2V
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The IS46DR16320C-3DBLA1 has a total of 78 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VSS | Ground | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 77 | DQ76 | Data input/output bit 76 | | 78 | DQ77 | Data input/output bit 77 |

Functional Features

• High-speed data transfer: The IS46DR16320C-3DBLA1 operates at a speed of DDR4-3200, allowing for fast and efficient data transfer.
• Low power consumption: With a voltage of 1.2V, this memory module consumes less power, making it energy-efficient.
• High-density storage: The 16 Gigabit capacity allows for storing a large amount of data in a compact form factor.
• Reliable performance: The IS46DR16320C-3DBLA1 is designed to provide stable and reliable memory operations.

Advantages and Disadvantages

Advantages: - High-speed operation enables faster data processing. - Low power consumption helps reduce energy costs. - High-density storage allows for more data to be stored in a smaller space. - Reliable performance ensures consistent memory operations.

Disadvantages: - Higher cost compared to lower capacity memory modules. - Limited compatibility with older systems that do not support DDR4 technology.

Working Principles

The IS46DR16320C-3DBLA1 is based on the working principles of Dynamic Random Access Memory (DRAM). It stores data as electrical charges in capacitors within its memory cells. To retain the stored data, these capacitors need to be periodically refreshed. When data needs to be read or written, the appropriate row and column addresses are accessed, allowing the data to be retrieved or modified.

Detailed Application Field Plans

The IS46DR16320C-3DBLA1 is commonly used in various applications that require high-speed and high-density memory, such as: - Computer systems (desktops, laptops, servers) - Networking equipment - Graphics processing units (GPUs) - Consumer electronics (smartphones, tablets, gaming consoles)

Detailed and Complete Alternative Models

• IS46DR16320C-3DBLH1: Similar specifications but with a different package type (TSOP)
• IS46DR16320C-3DBLI1: Similar specifications but with a different organization (4G x 4 bits)
• IS46DR16320C-3DBLK1: Similar specifications but with a higher operating temperature range (-40°C to +105°C)

Note: This entry provides an overview of the IS46DR16320C-3DBLA1 memory module. For more detailed technical information, please refer to the product datasheet or consult the manufacturer's documentation.

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