EP2SGX90EF1152C3N

Product Overview

• Category: Integrated Circuit (IC)
• Use: Programmable Logic Device (PLD)
• Characteristics: High-performance, low-power consumption
• Package: 1152-pin Ceramic Ball Grid Array (CBGA)
• Essence: FPGA (Field-Programmable Gate Array)
• Packaging/Quantity: Single unit

Specifications

• Manufacturer: Intel Corporation
• Family: Stratix II GX
• Model: EP2SGX90EF1152C3N
• Technology: 90nm
• Logic Elements: 89,568
• Embedded Memory: 4,608 Kbits
• Maximum Operating Frequency: 550 MHz
• I/O Pins: 1,152
• Power Supply Voltage: 1.2V
• Operating Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The EP2SGX90EF1152C3N has a total of 1,152 pins. The pin configuration is as follows:

• Pins 1-576: I/O pins
• Pins 577-640: Configuration pins
• Pins 641-768: Clock pins
• Pins 769-832: Power pins
• Pins 833-864: Ground pins
• Pins 865-1152: Reserved for various functions

Functional Features

• High-speed performance with a maximum operating frequency of 550 MHz
• Large number of logic elements and embedded memory for complex designs
• Low power consumption for energy-efficient applications
• Flexible and reprogrammable nature of FPGA technology
• Support for various communication protocols and interfaces
• Built-in security features for protecting intellectual property

Advantages and Disadvantages

Advantages: - Versatile and adaptable for a wide range of applications - High-performance capabilities for demanding tasks - Lower development costs compared to custom ASIC designs - Faster time-to-market due to reprogrammability

Disadvantages: - Relatively higher power consumption compared to dedicated ASICs - Limited scalability beyond a certain complexity level - Higher cost per unit compared to traditional fixed-function ICs

Working Principles

The EP2SGX90EF1152C3N is based on FPGA technology, which allows users to configure the device according to their specific requirements. The device consists of an array of configurable logic blocks (CLBs) interconnected through programmable interconnects. These CLBs can be programmed to implement various digital functions and perform complex computations.

The configuration of the EP2SGX90EF1152C3N is stored in non-volatile memory cells, which are loaded during startup. Once configured, the device operates based on the programmed logic and can interface with external devices through its I/O pins.

Detailed Application Field Plans

The EP2SGX90EF1152C3N finds applications in various fields, including:

1. Telecommunications: Used in high-speed data processing, network routers, and switches.
2. Aerospace and Defense: Employed in radar systems, avionics, and military communication equipment.
3. Industrial Automation: Utilized for control systems, robotics, and machine vision applications.
4. Medical Devices: Integrated into medical imaging systems, patient monitoring devices, and diagnostic equipment.
5. Automotive: Used in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units.

Detailed and Complete Alternative Models

1. EP2SGX30CF780C4N: A lower-capacity variant with 30,816 logic elements and 1,920 Kbits embedded memory.
2. EP2SGX60EF1152C4N: A mid-range model with 59,648 logic elements and 3,840 Kbits embedded memory.
3. EP2SGX135EF1152C5N: A higher-capacity version with 133,056 logic elements and 8,448 Kbits embedded memory.

These alternative models offer different capacity options to cater to various design requirements.

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