EP2AGX190FF35I3N

Product Overview

• Category: Integrated Circuit (IC)
• Use: Programmable Logic Device (PLD)
• Characteristics: High-performance, low-power consumption
• Package: Flip Chip BGA
• Essence: Advanced programmable logic solution
• Packaging/Quantity: Single unit

Specifications

• Manufacturer: Intel Corporation
• Family: Arria II GX
• Device Type: Field Programmable Gate Array (FPGA)
• Number of Logic Elements: 190,000
• Operating Temperature Range: -40°C to +100°C
• Supply Voltage: 1.2V
• Package Size: 35mm x 35mm
• Pin Count: 1517

Detailed Pin Configuration

The EP2AGX190FF35I3N has a total of 1517 pins. The pin configuration is as follows:

• Pin 1: VCCIO
• Pin 2: GND
• Pin 3: JTAG_TCK
• Pin 4: JTAG_TMS
• Pin 5: JTAG_TDI
• ...
• Pin 1517: GND

Please refer to the datasheet for the complete pin configuration.

Functional Features

• High-speed performance with advanced logic elements
• Low power consumption for energy-efficient applications
• Flexible and reprogrammable design for customization
• Support for various communication protocols
• On-chip memory blocks for data storage
• Built-in security features for protection against unauthorized access

Advantages and Disadvantages

Advantages

• High-performance capabilities suitable for demanding applications
• Low power consumption for energy-efficient operation
• Flexibility and reprogrammability allow for customization
• Support for various communication protocols enhances compatibility
• On-chip memory blocks provide efficient data storage
• Built-in security features ensure protection against unauthorized access

Disadvantages

• Relatively high cost compared to other programmable logic devices
• Steeper learning curve for programming and design implementation
• Limited availability of alternative models with similar specifications

Working Principles

The EP2AGX190FF35I3N is based on FPGA technology, which allows users to program the device according to their specific requirements. It consists of a large number of configurable logic elements interconnected through programmable interconnects. These logic elements can be programmed to perform various functions, such as arithmetic operations, data processing, and control tasks.

The device operates by configuring the internal connections between logic elements using a hardware description language (HDL) or a graphical user interface (GUI). Once programmed, the EP2AGX190FF35I3N executes the desired functionality by routing signals through the configured logic elements.

Detailed Application Field Plans

The EP2AGX190FF35I3N finds applications in various fields, including:

1. Telecommunications: Used in network infrastructure equipment for high-speed data processing and protocol handling.
2. Industrial Automation: Employed in control systems for real-time monitoring and process automation.
3. Automotive: Integrated into advanced driver assistance systems (ADAS) for image processing and sensor fusion.
4. Aerospace: Utilized in avionics systems for reliable and high-performance data processing.
5. Medical Devices: Incorporated into medical imaging equipment for signal processing and analysis.

Detailed and Complete Alternative Models

While the EP2AGX190FF35I3N offers advanced features and performance, there are alternative models available with similar capabilities. Some notable alternatives include:

1. Xilinx Virtex-7 XC7VX690T: Offers comparable logic capacity and performance.
2. LatticeECP5-190: Provides a lower-cost option with similar logic capacity.
3. Microsemi SmartFusion2 M2S190T: Combines FPGA and microcontroller capabilities for embedded applications.

These alternative models can be considered based on specific project requirements and cost considerations.

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