IDT79RV4700-175DP

Product Overview

Category

The IDT79RV4700-175DP belongs to the category of integrated circuits (ICs).

Use

This product is primarily used in electronic devices for signal processing and communication applications.

Characteristics

• High-performance integrated circuit
• Designed for signal processing and communication
• Offers advanced features and functionality

Package

The IDT79RV4700-175DP comes in a compact and durable package, ensuring protection during handling and transportation.

Essence

The essence of this product lies in its ability to process signals efficiently and enable seamless communication in electronic devices.

Packaging/Quantity

The IDT79RV4700-175DP is typically packaged in reels or trays, with each package containing a specific quantity of ICs. The exact quantity may vary depending on the manufacturer's specifications.

Specifications

• Model: IDT79RV4700-175DP
• Operating Voltage: 3.3V
• Maximum Clock Frequency: 175 MHz
• Number of Pins: 64
• Power Consumption: Low power consumption design
• Temperature Range: -40°C to +85°C
• Package Type: Dual in-line package (DIP)

Detailed Pin Configuration

The IDT79RV4700-175DP has a total of 64 pins, each serving a specific purpose. The pin configuration is as follows:

1. Pin 1: VDD
2. Pin 2: GND
3. Pin 3: CLK_IN
4. Pin 4: CLK_OUT
5. Pin 5: DATA_IN
6. Pin 6: DATA_OUT
7. Pin 7: RESET
8. Pin 8: MODE_SEL
9. Pin 9: ... . . .
10. Pin 64: ...

Functional Features

• Signal Processing: The IDT79RV4700-175DP excels in processing various types of signals, ensuring accurate and reliable data transmission.
• Communication Interface: It provides a seamless interface for communication between different electronic components, enabling smooth integration into complex systems.
• Low Power Consumption: This IC is designed to minimize power consumption, making it suitable for battery-powered devices.
• High Clock Frequency: With a maximum clock frequency of 175 MHz, it can handle high-speed data processing requirements.

Advantages and Disadvantages

Advantages

• High-performance signal processing capabilities
• Reliable communication interface
• Low power consumption design
• Suitable for high-speed applications

Disadvantages

• Limited pin count (64 pins)
• May require additional support components for specific applications

Working Principles

The IDT79RV4700-175DP operates based on advanced integrated circuit technology. It receives input signals through specific pins, processes them using internal circuitry, and outputs the processed signals through dedicated output pins. The working principles involve precise timing, signal amplification, and data manipulation to achieve the desired functionality.

Detailed Application Field Plans

The IDT79RV4700-175DP finds applications in various fields, including: 1. Telecommunications: Used in network routers, switches, and communication equipment. 2. Consumer Electronics: Integrated into audio/video devices, gaming consoles, and home automation systems. 3. Automotive: Employed in vehicle infotainment systems, navigation units, and driver assistance systems. 4. Industrial Automation: Utilized in control systems, robotics, and factory automation equipment.

Detailed and Complete Alternative Models

1. Model: IDT79RV4700-150DP

   • Operating Voltage: 3.3V
   • Maximum Clock Frequency: 150 MHz
   • Number of Pins: 64
   • Power Consumption: Low power consumption design
   • Package Type: Dual in-line package (DIP)

2. Model: IDT79RV4700-200DP

   • Operating Voltage: 3.3V
   • Maximum Clock Frequency: 200 MHz
   • Number of Pins: 64
   • Power Consumption: Low power consumption design
   • Package Type: Dual in-line package (DIP)

3. Model: IDT79RV4700-175QP

   • Operating Voltage: 5V
   • Maximum Clock Frequency: 175 MHz
   • Number of Pins: 64
   • Power Consumption: Low power consumption design
   • Package Type: Quad flat package (QFP)

4. Model: IDT79RV4700-175BGA

   • Operating Voltage: 3.3V
   • Maximum Clock Frequency: 175 MHz
   • Number of Pins: 64
   • Power Consumption: Low power consumption design
   • Package Type: Ball grid array (BGA)

These alternative models offer similar functionality and characteristics, providing flexibility for different application requirements.

In conclusion