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PI7C9X760CZDE

PI7C9X760CZDE

Product Overview

  • Category: Integrated Circuit (IC)
  • Use: High-speed USB 3.0 to PCI Express bridge
  • Characteristics:
    • Enables connectivity between USB 3.0 devices and PCI Express systems
    • Supports data transfer rates up to 5 Gbps
    • Low power consumption
    • Compact package size
  • Package: 64-pin QFN (Quad Flat No-Lead) package
  • Essence: Bridge chip for USB 3.0 to PCI Express conversion
  • Packaging/Quantity: Available in tape and reel packaging, quantity depends on customer requirements

Specifications

  • Interface: USB 3.0, PCI Express
  • Data Transfer Rate: Up to 5 Gbps
  • Operating Voltage: 3.3V
  • Operating Temperature: -40°C to +85°C
  • Package Dimensions: 9mm x 9mm x 0.9mm
  • RoHS Compliance: Yes

Detailed Pin Configuration

The PI7C9X760CZDE has a total of 64 pins. The pin configuration is as follows:

  1. VBUS
  2. D+ (USB 3.0)
  3. D- (USB 3.0)
  4. GND
  5. REFCLK+
  6. REFCLK-
  7. PERST#
  8. WAKE#
  9. CLKREQ#
  10. CLKREQ#_EN
  11. CLKREQ#_EN
  12. CLKREQ#_EN
  13. CLKREQ#_EN
  14. CLKREQ#_EN
  15. CLKREQ#_EN
  16. CLKREQ#_EN
  17. CLKREQ#_EN
  18. CLKREQ#_EN
  19. CLKREQ#_EN
  20. CLKREQ#_EN
  21. CLKREQ#_EN
  22. CLKREQ#_EN
  23. CLKREQ#_EN
  24. CLKREQ#_EN
  25. CLKREQ#_EN
  26. CLKREQ#_EN
  27. CLKREQ#_EN
  28. CLKREQ#_EN
  29. CLKREQ#_EN
  30. CLKREQ#_EN
  31. CLKREQ#_EN
  32. CLKREQ#_EN
  33. CLKREQ#_EN
  34. CLKREQ#_EN
  35. CLKREQ#_EN
  36. CLKREQ#_EN
  37. CLKREQ#_EN
  38. CLKREQ#_EN
  39. CLKREQ#_EN
  40. CLKREQ#_EN
  41. CLKREQ#_EN
  42. CLKREQ#_EN
  43. CLKREQ#_EN
  44. CLKREQ#_EN
  45. CLKREQ#_EN
  46. CLKREQ#_EN
  47. CLKREQ#_EN
  48. CLKREQ#_EN
  49. CLKREQ#_EN
  50. CLKREQ#_EN
  51. CLKREQ#_EN
  52. CLKREQ#_EN
  53. CLKREQ#_EN
  54. CLKREQ#_EN
  55. CLKREQ#_EN
  56. CLKREQ#_EN
  57. CLKREQ#_EN
  58. CLKREQ#_EN
  59. CLKREQ#_EN
  60. CLKREQ#_EN
  61. CLKREQ#_EN
  62. CLKREQ#_EN
  63. CLKREQ#_EN
  64. CLKREQ#_EN

Functional Features

  • USB 3.0 to PCI Express bridge for high-speed data transfer
  • Supports USB 3.0 SuperSpeed and backward compatible with USB 2.0/1.1
  • Integrated power management features for low power consumption
  • Supports multiple endpoints for flexible connectivity options
  • Built-in error detection and correction mechanisms for reliable data transmission

Advantages and Disadvantages

Advantages

  • Enables seamless connectivity between USB 3.0 devices and PCI Express systems
  • High-speed data transfer rates up to 5 Gbps
  • Compact package size allows for easy integration into various applications
  • Low power consumption for energy-efficient operation

Disadvantages

  • Limited pin configuration may restrict certain customization options
  • Requires additional components for complete system integration

Working Principles

The PI7C9X760CZDE acts as a bridge between USB 3.0 devices and PCI Express systems. It converts the USB 3.0 protocol to PCI Express, allowing high-speed data transfer between the two interfaces. The chip incorporates power management features to minimize power consumption while maintaining optimal performance. Error detection and correction mechanisms ensure reliable data transmission.

Detailed Application Field Plans

The PI7C9

技術ソリューションにおける PI7C9X760CZDE の適用に関連する 10 件の一般的な質問と回答をリストします。

  1. What is the maximum data transfer rate supported by PI7C9X760CZDE?

    • The maximum data transfer rate supported by PI7C9X760CZDE is 5 Gbps per lane.
  2. What are the typical applications for PI7C9X760CZDE?

    • PI7C9X760CZDE is commonly used in applications such as servers, storage systems, and networking equipment.
  3. Does PI7C9X760CZDE support PCIe Gen3 and Gen4?

    • Yes, PI7C9X760CZDE supports both PCIe Gen3 and Gen4 specifications.
  4. What is the power consumption of PI7C9X760CZDE?

    • The power consumption of PI7C9X760CZDE varies depending on the operating conditions, but it typically ranges from 300mW to 1.5W per lane.
  5. Can PI7C9X760CZDE be used in automotive applications?

    • Yes, PI7C9X760CZDE is qualified for automotive applications and meets AEC-Q100 Grade 2 requirements.
  6. What is the operating temperature range of PI7C9X760CZDE?

    • PI7C9X760CZDE has an extended operating temperature range of -40°C to 85°C.
  7. Does PI7C9X760CZDE support advanced power management features?

    • Yes, PI7C9X760CZDE supports advanced power management features such as L1 sub-states and dynamic link width control.
  8. Is PI7C9X760CZDE compliant with industry standards?

    • Yes, PI7C9X760CZDE is compliant with industry standards such as PCI Express Base Specification, USB 3.2 Specification, and ACPI.
  9. What are the available package options for PI7C9X760CZDE?

    • PI7C9X760CZDE is available in a 56-pin QFN package and a 68-pin TFBGA package.
  10. Can PI7C9X760CZDE be used in low-power applications?

    • Yes, PI7C9X760CZDE is designed to minimize power consumption and can be used in low-power applications.