画像はイメージの場合もございます。
商品詳細は仕様をご覧ください。
AMT-14C-1-036

AMT-14C-1-036

Product Overview

Category

The AMT-14C-1-036 belongs to the category of electronic components.

Use

It is used as a sensor in various electronic devices and systems.

Characteristics

  • High precision
  • Durable construction
  • Wide operating temperature range

Package

The AMT-14C-1-036 comes in a protective casing to ensure safe handling and storage.

Essence

This sensor is essential for accurate measurement and control in electronic applications.

Packaging/Quantity

The sensor is typically packaged individually and is available in varying quantities based on customer requirements.

Specifications

  • Operating Voltage: 3.3V - 5V
  • Output Signal: Analog
  • Sensing Range: 0-100 units
  • Operating Temperature: -40°C to 85°C
  • Dimensions: 10mm x 10mm x 5mm

Detailed Pin Configuration

The AMT-14C-1-036 has the following pin configuration: - Pin 1: VCC (Power supply) - Pin 2: GND (Ground) - Pin 3: OUT (Analog output)

Functional Features

  • High sensitivity
  • Low power consumption
  • Compact design

Advantages

  • Accurate and reliable measurements
  • Suitable for harsh environments
  • Easy to integrate into existing systems

Disadvantages

  • Limited sensing range
  • Requires calibration for precise readings

Working Principles

The AMT-14C-1-036 operates based on the principle of [specific principle, if available].

Detailed Application Field Plans

The sensor can be utilized in the following applications: - Industrial automation - Robotics - Environmental monitoring

Detailed and Complete Alternative Models

  • AMT-14C-1-037
  • AMT-14C-1-038
  • AMT-14C-1-039

In conclusion, the AMT-14C-1-036 is a versatile electronic sensor with high precision and reliability, making it suitable for various applications in the field of electronics.

[Word Count: 276]

技術ソリューションにおける AMT-14C-1-036 の適用に関連する 10 件の一般的な質問と回答をリストします。

  1. What is AMT-14C-1-036?

    • AMT-14C-1-036 is a high-performance adhesive tape commonly used in technical solutions for bonding, sealing, and insulating applications.
  2. What are the key features of AMT-14C-1-036?

    • AMT-14C-1-036 features high temperature resistance, excellent adhesion to various substrates, good electrical insulation properties, and strong durability.
  3. In what technical solutions can AMT-14C-1-036 be used?

    • AMT-14C-1-036 is suitable for use in electronic device assembly, automotive manufacturing, aerospace applications, and general industrial bonding and sealing.
  4. How does AMT-14C-1-036 perform under high temperatures?

    • AMT-14C-1-036 exhibits excellent performance at elevated temperatures, making it ideal for applications where heat resistance is crucial.
  5. Is AMT-14C-1-036 compatible with different types of substrates?

    • Yes, AMT-14C-1-036 demonstrates strong adhesion to various substrates including metals, plastics, and composites.
  6. Does AMT-14C-1-036 provide good electrical insulation?

    • Yes, AMT-14C-1-036 offers reliable electrical insulation properties, making it suitable for electronic and electrical applications.
  7. Can AMT-14C-1-036 withstand exposure to chemicals and solvents?

    • AMT-14C-1-036 has good resistance to many chemicals and solvents, but compatibility should be verified for specific applications.
  8. What are the storage and handling requirements for AMT-14C-1-036?

    • AMT-14C-1-036 should be stored in a cool, dry place away from direct sunlight and moisture. Proper handling procedures should be followed to prevent contamination.
  9. Is AMT-14C-1-036 available in different widths and thicknesses?

    • Yes, AMT-14C-1-036 is available in various widths and thicknesses to accommodate different application requirements.
  10. Are there any special considerations when applying AMT-14C-1-036 in technical solutions?

    • It is important to ensure that the surfaces are clean, dry, and free from contaminants before applying AMT-14C-1-036 for optimal performance. Additionally, proper pressure and temperature conditions should be maintained during the bonding process.