AS4C64M16D3LB-12BIN

Basic Information Overview

• Category: Memory module
• Use: Storage and retrieval of digital information in electronic devices
• Characteristics:
  • High capacity
  • Fast data transfer rate
  • Low power consumption
• Package: Integrated circuit (IC)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Bulk packaging, typically sold in large quantities

Specifications

• Model: AS4C64M16D3LB-12BIN
• Capacity: 64 megabits (8 megabytes)
• Organization: 64M words x 16 bits x 4 banks
• Speed: 12ns (nanoseconds)
• Voltage: 1.35V (operating), 1.5V (maximum)
• Interface: Double Data Rate 3 (DDR3)
• Operating Temperature: -40°C to +85°C

Detailed Pin Configuration

The AS4C64M16D3LB-12BIN memory module has a specific pin configuration for proper connectivity within a system. The detailed pin configuration is as follows:

1. VDD
2. DQ0
3. DQ1
4. DQ2
5. DQ3
6. DQ4
7. DQ5
8. DQ6
9. DQ7
10. DQ8
11. DQ9
12. DQ10
13. DQ11
14. DQ12
15. DQ13
16. DQ14
17. DQ15
18. VSS
19. NC
20. A0
21. A1
22. A2
23. A3
24. A4
25. A5
26. A6
27. A7
28. A8
29. A9
30. A10
31. A11
32. A12
33. A13
34. A14
35. A15
36. BA0
37. BA1
38. RAS#
39. CAS#
40. WE#
41. CK
42. CK#
43. VSS
44. VDD

Functional Features

• High-speed data transfer: The AS4C64M16D3LB-12BIN memory module offers fast data transfer rates, allowing for efficient storage and retrieval of information.
• Low power consumption: This memory module is designed to consume minimal power, making it suitable for battery-powered devices.
• Large capacity: With a capacity of 64 megabits, the AS4C64M16D3LB-12BIN provides ample storage space for various applications.

Advantages and Disadvantages

Advantages: - High-speed performance - Low power consumption - Large storage capacity

Disadvantages: - Relatively higher cost compared to other memory modules - Limited compatibility with older systems that do not support DDR3 interface

Working Principles

The AS4C64M16D3LB-12BIN operates based on the principles of dynamic random access memory (DRAM). It stores digital information in capacitors within its memory cells, which are organized into banks. To read or write data, the module utilizes a combination of address lines, control signals, and clock signals to access specific memory locations.

Detailed Application Field Plans

The AS4C64M16D3LB-12BIN memory module finds application in various electronic devices, including but not limited to: - Personal computers - Laptops - Servers - Networking equipment - Consumer electronics (e.g., gaming consoles, set-top boxes)

Detailed and Complete Alternative Models

• AS4C64M16D3LB-12BCN
• AS4C64M16D3LB-12BCN-T
• AS4C64M16D3LB-12BCNTR
• AS4C64M16D3LB-12BCNTR-T

These alternative models offer similar specifications and functionality to the AS4C64M16D3LB-12BIN, providing options for different sourcing or compatibility requirements.

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